Five Samsung Electronics Researchers Named IEEE Fellows

Samsung Electronics today announced that five of its researchers from around the world have been selected as 2025 Fellows of the Institute of Electrical and Electronics Engineers¹ (IEEE), one of the world’s most prestigious engineering organizations. The Samsung researchers include:

 

• Paul Kyungwhoon Cheun, President, CTO of the Device eXperience (DX) Division and Head of Samsung Research
• Younsun Kim, Master at Samsung Research
• Timothy Hospedales, Head of Samsung Research’s Europe AI Center
• Michael Scott Brown, Head of Samsung Research’s AI Center in Toronto
• Yuri Masuoka, Fellow and Head of the SRAM Lab in the Foundry Business of the Device Solutions (DS) Division

 

The title of ‘IEEE Fellow’ is the highest membership grade and, following a thorough review process, is granted annually to the top 0.1% of IEEE members who have demonstrated significant contributions to societal advancement. Those with at least ten years of experience in their fields are chosen based on seven evaluation criteria, including outstanding research and development achievements, contributions to the industry and expertise in the field.

 

 

Achievements in Telecommunications and Standardization of 5G Mobile Communication

▲ President Paul Kyungwhoon Cheun (left) and Master Younsun Kim (right)

 

Paul Kyungwhoon Cheun was appointed as a Fellow in recognition of his leadership in 5G and virtualized Radio Access Network (vRAN) technologies.

 

Having joined Samsung Electronics in 2012 and serving as head of the Network Business Division, Cheun is a telecommunications technology expert who has led the development of core technologies and commercial solutions for 5G. He has contributed to the global network business by successfully commercializing the world’s first 5G mobile communication technology.

 

“Being appointed as an IEEE Fellow is an honor,” said President Cheun. “Samsung Electronics will dedicate itself more to innovative technology research and development that will lead the future, taking the initiative in technological advancements that add value and provide convenience and enrichment to people’s daily lives.”

 

Younsun Kim received IEEE recognition for contributions and leadership in 5G physical layer standardization. He has served as both the vice chair and chair of the 3rd Generation Partnership Project (3GPP) Radio Access Network Working Group 1 (RAN WG1) for the past seven years, and is currently preparing for 6G RAN standardization which will be fully launched starting from next year.

 

 

Newly Elevated Fellows in Machine Learning, Cameras and Foundry

▲ Timothy Hospedales (left) and Michael Scott Brown (right)

 

Timothy Hospedales received Fellowship honors for his contributions to data-efficient machine learning and meta-learning. Hospedales, who joined Samsung Electronics in 2019, is a machine learning and data intelligence expert. Currently, he oversees Samsung Research’s overall research and development of AI across Europe at the AI Center located in Cambridge, U.K..

 

Michael Scott Brown contributed to in-camera color image processing to a degree that led to the IEEE naming him a Fellow. Brown, joined Samsung Electronics in 2019 and is an expert in computer vision, currently overseeing research and development at the AI Center in Toronto.

 

Yuri Masuoka was also named to the IEEE Fellow Class of 2025 for her contributions to leading-edge foundry transistor development.

 

Samsung Electronics has previously had several IEEE Fellows in various fields, including Executive Vice President Sunghyun Choi of the Network Business, Fellow Juho Lee of Samsung Research and Senior Vice President Charlie Zhang of Samsung Research.

 

 

¹ The Institute of Electrical and Electronics Engineers (IEEE) is the largest professional organization dedicated to the advancement of technology related to electricity, electronics, computing, and telecommunications. With over 460,000 members from more than 190 countries, IEEE actively manages over 2,250 ongoing projects.